MODU II SGL ROW 12P REC.ASSY TIN HMT
| Weight | 0.05 kg |
|---|---|
| Manufacturer | TE CONNECTIVITY/AMP BRAND |
| Part Number | 281336-1 |
| PRC | AMP |
| Centerline (Pitch) | .1 in 2.54 mm |
| Circuit Application | Signal |
| Connector & Contact Terminates To | Printed Circuit Board |
| Connector Height | .159 in 4 mm |
| Connector Length | 1.22 in 31 mm |
| Connector Mounting Type | Board Mount |
| Connector Profile | Standard |
| Connector System | Board-to-Board |
| Contact Base Material | Phosphor Bronze |
| Contact Current Rating (Max) | 3:00 AM |
| Contact Layout | Inline |
| Contact Mating Area Plating Material | Tin |
| Contact Mating Area Plating Material Thickness | 30 µin .76 µm |
| Contact Shape & Form | Dual Tine Square |
| Contact Type | Socket |
| Housing Material | LCP (High Temp Thermoplastic) |
| Mating Alignment | Without |
| Mating Square Post Dimension | .025 in .64 mm |
| Number of Positions | 12 |
| Number of Rows | 1 |
| Operating Temperature Range | -65 – 105 °C -85 – 221 °F |
| Packaging Quantity | 54 |
| Packaging Type | Tray |
| PCB Connector Assembly Type | PCB Mount Receptacle |
| PCB Contact Termination Area Plating Material | Tin |
| PCB Contact Termination Area Plating Material Finish | Matte |
| PCB Contact Termination Area Plating Material Thickness | 30 µin .76 µm |
| PCB Mount Alignment | Without |
| PCB Mount Orientation | Right Angle |
| PCB Mount Retention | Without |
| PCB Thickness (Recommended) | .062 in 1.6 mm |
| Primary Product Color | Black |
| Sealable | No |
| Termination Method to Printed Circuit Board | Through Hole - Solder |
| Termination Post & Tail Length | .138 in 3.5 mm |
| UL Flammability Rating | UL 94V-0 |
Terminals N/I-RING 12-10 #5/16 M8+
HVS-HE.20.Sti.C
RF Adapters-Between Series SMA JACK TO SMA JACK
