5536649-1

High Speed/Modular Conn REC 2X005P R/A B-PLANE

In-stock: 84

Bulk Quantity & Price List


Quantity
Unit price
Ext price
48+
US$7.74
US$371.52
96+
US$7.62
US$731.52
144+
US$7.48
US$1,077.12
240+
US$7.35
US$1,764.00

Additional information

Weight 0.05 kg
Manufacturer TE CONNECTIVITY/AMP BRAND
Part Number 5536649-1
PRC AMP
Centerline (Pitch) .079 in 2 mm
Circuit Application Power
Connector & Contact Terminates To Printed Circuit Board
Connector & Housing Type Receptacle
Connector Height .523 in 13.3 mm
Connector Mounting Type Board Mount
Connector System Board-to-Board
Contact Base Material Phosphor Bronze
Contact Current Rating (Max) 3 A 5 A
Contact Layout Matrix
Contact Mating Area Plating Material Gold
Contact Mating Area Plating Material Thickness 30 µin .76 µm
Contact Retention Within Housing With
Contact Type Receptacle
Glow Wire Rating Standard Part - Not Glow Wire
Housing Color Natural
Housing Material LCP (Liquid Crystal Polymer)
Mating Alignment Type Polarizing Rib
Number of Positions 10
Number of Power Positions 10
Number of Rows 5
Operating Temperature Range -55 – 125 °C -67 – 257 °F
Operating Voltage 30 VAC 30 VDC
Packaging Method Tube
Packaging Quantity 48
PCB Contact Termination Area Plating Material Tin
PCB Contact Termination Area Plating Material Thickness 50 µin 1.27 µm
PCB Mount Orientation Right Angle
PCB Mount Retention With
PCB Mount Retention Type Solder Peg
Row-to-Row Spacing .079 in 2 mm
Sealable No
Termination Method to Printed Circuit Board Through Hole - Press-Fit Through Hole - Solder
Termination Post & Tail Length .14 in 3.56 mm
UL Flammability Rating UL 94V-0