Mezalok Socket 114 p 18 mm 50 Au
| Weight | 0.05 kg |
|---|---|
| Manufacturer | TE CONNECTIVITY/AMP BRAND |
| Part Number | 2355825-9 |
| PRC | AMP |
| Centerline (Pitch) | .05 in 1.27 mm |
| Circuit Application | Signal |
| Connector & Contact Terminates To | Printed Circuit Board |
| Connector Height | .236 in 6 mm |
| Connector Mounting Type | Board Mount |
| Connector System | Board-to-Board |
| Contact Base Material | Beryllium Copper |
| Contact Current Rating (Max) | 1.5 A |
| Contact Layout | Matrix |
| Contact Mating Area Plating Material | Gold |
| Contact Mating Area Plating Material Thickness | 50 µin 50 µm |
| Contact Type | Socket |
| Dielectric Withstanding Voltage (Max) | 750 VAC |
| Housing Material | LCP |
| Mating Alignment | With |
| Mating Alignment Type | Keyed |
| Mating Tab Thickness | .018 in .46 mm |
| Mating Tab Width | .017 in .43 mm |
| Number of Positions | 114 |
| Number of Rows | 6 |
| Operating Temperature Range | -55 – 125 °C -67 – 257 °F |
| Operating Voltage | 250 VAC |
| Packaging Quantity | 450 |
| Packaging Type | Tape & Reel |
| PCB Connector Assembly Type | PCB Mount Receptacle |
| PCB Contact Termination Area Plating Material | Tin-Lead |
| PCB Mount Alignment | Without |
| PCB Mount Orientation | Vertical |
| PCB Mount Retention | Without |
| Primary Product Color | Natural |
| Row-to-Row Spacing | .05 in 1.27 mm |
| Sealable | No |
| Termination Method to Printed Circuit Board | Surface Mount - Solder Ball |
| UL Flammability Rating | UL 94V-0 |
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