204 Position SODIMM DDR3 SDRAM Socket Surface Mou
| Weight | 0.05 kg |
|---|---|
| Manufacturer | TE CONNECTIVITY/AMP BRAND |
| Part Number | 2-2013290-2 |
| PRC | AMP |
| Centerline (Pitch) | .024 in .6 mm |
| Circuit Application | Power |
| Connector & Contact Terminates To | Printed Circuit Board |
| Connector Mounting Type | Board Mount |
| Connector Profile | Reverse |
| Connector System | Cable-to-Board |
| Contact Base Material | Copper Alloy |
| Contact Current Rating (Max) | .5 A |
| Contact Mating Area Plating Material | Gold |
| Contact Mating Area Plating Material Thickness | 10 µin .254 µm |
| Housing Color | Black |
| Housing Material | High Temperature Thermoplastic |
| Mating Alignment Type | Reverse Keying |
| Number of Positions | 204 |
| Number of Rows | 2 |
| Operating Temperature Range | -55 – 85 °C -67 – 185 °F |
| Packaging Method | Emboss on Reel |
| Packaging Quantity | 200 |
| PCB Contact Termination Area Plating Material | Gold |
| PCB Mount Retention | With |
| PCB Mount Retention Type | Solder Peg |
| Row-to-Row Spacing | .322 in 8.2 mm |
| UL Flammability Rating | UL 94V-0 |
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