High Speed/Modular Conn IMP100S H V3P8C UG OEW46
| Weight | 0.05 kg |
|---|---|
| Manufacturer | TE CONNECTIVITY/AMP BRAND |
| Part Number | 2057760-2 |
| PRC | AMP |
| Approved Standards | CSA Certified UL E28476 |
| Centerline (Pitch) | .075 in 1.9 mm |
| Circuit Application | Signal |
| Connector & Contact Terminates To | Printed Circuit Board |
| Connector Height | .47 in 11.95 mm |
| Connector Length | .594 in 15.1 mm |
| Connector Mounting Type | Board Mount |
| Connector System | Board-to-Board |
| Contact Base Material | Copper Alloy |
| Contact Current Rating (Max) | .75 A |
| Contact Layout | Inline |
| Contact Mating Area Plating Material | Gold |
| Contact Mating Area Plating Material Thickness | 29.92 µin .76 µm |
| Contact Shape & Form | Dual Beam |
| Contact Type | Pin |
| Contact Underplating Material | Nickel |
| Housing Material | LCP (Liquid Crystal Polymer) |
| Mating Alignment | With |
| Mating Alignment Type | Guide Pin |
| Mating Retention | Without |
| Number of Positions | 72 |
| Number of Rows | 9 |
| Number of Signal Positions | 48 |
| Operating Temperature Range | -55 – 85 °C -67 – 185 °F |
| Operating Voltage | 30 VAC 30 VDC |
| Packaging Method | Box Box & Tube |
| PCB Connector Assembly Type | PCB Mount Header |
| PCB Contact Termination Area Plating Material | Tin |
| PCB Contact Termination Area Plating Material Finish | Matte |
| PCB Contact Termination Area Plating Material Thickness | 50 µin 1.27 µm |
| PCB Mount Orientation | Vertical |
| PCB Mount Retention | With |
| PCB Mount Retention Type | Action/Compliant Tail |
| PCB Thickness (Recommended) | .039 in |
| Primary Product Color | Black |
| Row-to-Row Spacing | .053 in 1.35 mm |
| Termination Method to Printed Circuit Board | Through Hole - Press-Fit |
| Termination Post & Tail Length | .047 in 1.2 mm |
| UL Flammability Rating | UL 94V-0 |
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