2311768-1

D-Sub High Density Conn AMPL REC HD22 R/A 26P

In-stock: 1,745

Bulk Quantity & Price List


Quantity
Unit price
Ext price
280+
US$6.87
US$1,923.60
1120+
US$6.57
US$7,358.40
5000+
US$5.99
US$29,950.00
10000+
US$5.61
US$56,100.00
25000+
US$5.24
US$131,000.00

Additional information

Weight 0.05 kg
Manufacturer TE CONNECTIVITY/AMP BRAND
Part Number 2311768-1
PRC AMP
Centerline (Pitch) .09 in 2.29 mm
Circuit Application Signal
Connector & Contact Terminates To Printed Circuit Board
Connector & Housing Type Receptacle
Connector Mounting Type Board Mount
Connector Profile Standard
Connector System Wire-to-Board
Contact Current Rating (Max) 3:00 AM
Contact Shape & Form Round
Housing Material PBT GF
Mating Retention With
Mating Retention Type Threaded Inserts 4-40 UNC
Number of Positions 26
Number of Rows 3
Operating Temperature Range -55 – 85 °C -67 – 185 °F
PCB Mount Orientation Right Angle
PCB Mount Retention With
PCB Mount Retention Type Boardlock
Primary Product Color Black
Row-to-Row Spacing .077 in 1.98 mm
Termination Method to Printed Circuit Board Through Hole - Solder